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High-quality and proven process materials are the foundation of reliable contract electronics manufacturing
In our contract electronics manufacturing, we use only certified, stable, and proven process materials that ensure high process repeatability, excellent soldering quality, and long-term reliability of electronic assemblies. Materials are selected according to the type of assembly (manual, SMT, THT), product class, and RoHS and IPC requirements.
Solder pastes for SMT
We use lead-free solder pastes with controlled particle size and stable viscosity, providing good wetting, minimal voids, and clean solder joints.
Main material: lead-free solder paste DP 5505.
Solders for manual and automated assembly
We work with both lead-free and leaded solders in various diameters.
Lead-free solders (RoHS):
Sn95.5Ag3.8Cu0.7
Sn99.3Cu0.7 (wire, various diameters)
Sn99.3Cu0.7 (solder pellets)
Leaded solders Sn63Pb37:
Used for service, prototyping, and non-RoHS applications.
Available diameters: 0.5 mm – 2.5 mm.
Fluxes and flux gels
Water-soluble flux IF2009M – for general assembly and easy cleaning
Flux gel IF8300 for BGA – for reballing and hidden-lead packages
Our quality approach
Only controlled batches, proper storage, incoming inspection, and full material traceability.
Customer benefits
✔ stable soldering quality
✔ low defect rate
✔ long product lifetime
✔ compliance with international standards
We believe that quality materials are the basis of reliable electronics, which is why we pay special attention to every component and every gram of solder used in production.