Electronic Technology ensures the highest product quality through meticulous controls at every stage of production, from incoming inspections to final packaging.
- Visual Inspection: Every product undergoes 100% visual inspection directly on the assembly line.
- Defect Prevention: Comprehensive monitoring throughout the manufacturing process eliminates the risk of defective goods reaching our customers.
Equipment for testing the quality of solder joints
The quality of solder joints in electronic modules is tested at each technological stage of assembly in accordance with the requirements of the international industrial standard IPC-A-610.
- The quality control of SMD component assembly is carried out using automated optical equipment.
- BGA component assembly control is done with a digital microscope with a 100x magnification, Optilia BGA inspection.
- Leaded component assembly is visually controlled using an instrument microscope and magnifying lenses.
Our focus on quality and precision makes Electronic Technology a trusted partner for advanced electronics manufacturing.