Lead-free solder KuPing Sn99.3Cu0.7, Ø1.0 mm, No-Clean flux 1.1%, 500 g

KuPing lead-free solder wire Sn99.3Cu0.7 with No-Clean flux 1.1% is designed for manual soldering and general electronics assembly in lead-free manufacturing. It provides stable melting, good wetting, and strong, clean solder joints with minimal residues.

The No-Clean flux does not require post-solder cleaning; residues are non-sticky and do not affect electrical reliability.

Key features:

• Alloy: Sn99.3Cu0.7 (lead-free, RoHS compliant)

• Wire diameter: 1.0 mm

• Flux: No-Clean 1.1%

• Low-residue performance

• Package: 500 g spool

• Manufacturer: KuPing (Taiwan)