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In our production we mainly use DP 5505 series solder pastes supplied with lead-free alloys:
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Sn96.5Ag3Cu0.5
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Sn95.5Ag4Cu0.5
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Sn99Ag0.3Cu0.7 (others on request)
Available in Type 3 / Type 4 / Type 5 powder sizes and in jars or syringes, providing flexibility for different processes.
DP 5505 solder pastes are designed for modern SMD assembly, offering stable stencil printing, uniform reflow, and high joint reliability.
They are ideal for serial and contract manufacturing and recommended for professional electronics applications.