Interflux DP 5505 is a premium lead-free, no-clean solder paste developed by Interflux Electronics N.V. (Belgium) for advanced SMT assembly and high-reliability electronics manufacturing. The paste is halide-free and classified as RO L0 according to IPC J-STD-004A, ensuring excellent post-reflow reliability without the need for cleaning.

DP 5505 has been specifically engineered to minimize the “hidden pillow” defect in BGA assemblies and to deliver low voiding performance, meeting IPC 7095 voiding performance class 3. Its chemistry provides high resistance to moisture and elevated temperatures, making it suitable for demanding production environments .

Thanks to its optimized rheology, DP 5505 offers excellent stencil printing performance, supports high printing speeds, works reliably with small stencil apertures, and is perfectly suited for Pin-in-Paste applications. After reflow, residues are minimal, clear, and electrically reliable, allowing easy ICT and flying-probe testing.

Key benefits:

• No-clean formulation — no post-reflow cleaning required
• Lead-free and absolutely halogen-free (RO L0)
• Optimized to prevent hidden pillow defects on BGAs
• Low voiding, compliant with IPC 7095 Class 3
• High stability and long abandon time
• Excellent printability on fine-pitch designs
• Suitable for SMT, BGA, CSP, and Pin-in-Paste processes
• Compatible with linear and soak reflow profiles

DP 5505 is available with lead-free alloys such as Sn96.5Ag3Cu0.5, Sn95.5Ag4Cu0.5, and Sn99Ag0.3Cu0.7, in multiple powder sizes (Type 3 / 4 / 5) and packaging options (jars and syringes), offering flexibility for a wide range of production requirements.

Manufacturer: Interflux Electronics N.V. Designed for professional use in electronics and electrical engineering.