KuPing lead-free solder wire Sn99.3Cu0.7 is a high-quality solder developed in accordance with RoHS requirements for chlorine-free and halogen-controlled materials. The flux is based on high-purity hydrogenated rosin combined with advanced activators, providing stable performance and excellent wetting.

The solder wire features a mild rosin scent, good dispersion, and high stability, ensuring smooth solder flow and reliable joint formation. It is well suited for manual soldering and general electronics assembly.

Key Specifications

• Type: Lead-free solder wire

• Alloy: Sn99.3Cu0.7 (Sn/Cu)

• Wire diameter: 0.8 mm

• Flux content: 2% (No-Clean)

• Flux type: RMA

• Halogen content: ≤0.20%

• Insulation resistance: >1×10¹² Ω

• Package: 500 g spool

Advantages

• RoHS compliant

• Good wetting and stable soldering performance

• Minimal residues after soldering

• Suitable for manual soldering and repair work

Applications

• Manual assembly of electronic components

• General soldering operations

• Electronics manufacturing and service